CircuitData-Language

An open language for communicating Printed Circuits Specifications, Requirements and Capabilities

View the Project on GitHub CircuitData/CircuitData-Language

Structure for specifications

We divide the specifications into a few major groups:

Sections

To understand sections, you should read this document. The sections part allows you to divide the product you are describing into several sections and then allow the layers to appear in one or more of them. A single section product needs to contain at least one section. Like this example:

"sections": [
  {
       "name": "rigid1",
       "in_x": [1],
       "in_y": [1],
       "mm2": 400
   }
]

Layers

The “layers” element type is an “array”. Layers include everything which is part of the finished product (could be a PCB). It is not limited by the traditional convention of a “stack up” but will also contain layers like a peelable mask. An example of one conductive layer in the structure would be:

"layers": [
  {
    "order": 1,
    "name": "conductive_layer_1",
    "function": "conductive",
    "flexible": false,
    "materials": ["copper"],
    "sections": ["main_rigid"],
    "thickness": 34.8,
    "tolerance_minus": 0.1,
    "tolerance_plus": 0.1,
    "coverage": 34,
    "attributes": {
      "minimum_track_width": 0.135,
      "minimum_spacing_width": 0.15,
      "function": "signal",
      "polarity": "positive"
    }
  }
]

How to describe layers

Potential tags are:

Tags Description Type Uom Required
order Order of the layer as seen in a cross section and counted from above integer None Yes
uuid An unique identifier for the layer string None Yes
name A given name for the layer. Must be unique amongst the layers. Can be any string without spaces string None Yes
function The function of layer. See the list of potential functions below string None Yes
flexible True or false to indicate if this layer is flexible or not boolean None No - default is “False”
materials An array of materials that appear in the materials element. There can be more than one Array of String None Yes
sections An array of the sections where the layer appears (use the name of the section) Array of strings None Yes
thickness The thickness of the layer in micrometers number micrometers No
tolerance_minus Allowed deviation of thickness on the minus side number micrometers No
tolerance_plus Allowed deviation of thickness on the plus side number micrometers No
sub_material_thickness Thickness of individual components in a multicomponent layer. Read more here object None No
coverage  How many percent of the section is covered by the layer (related to the mm2 value) number  percent  No - default is 100
layer_attributes  A object containing attributes to further describe the layer. See potential attributes under each layer type object None  No

Layer functions and their attributes

Potential values are:

Thickness of individual components

Some materials, such as an ENIG final finish are made up from two or more material. In such cases, it can be useful to be able to specify the individual materials minimum and/or maximum thickness. You can do this in CircuitData by adding an object under the “sub_material_thickness” object. The name of the object should represent the material itself, e.g. “gold” and then you can place a “minimum” and or “maximum” object there with the type of “number” and UoM of micrometers. Example:

"layers": [
  {
    "order": 1,
    "name": "top_final_finish",
    "function": "final_finish",
    "flexible": false,
    "materials": ["ENIG"],
    "sections": ["main_rigid"],
    "coverage": 100,
    "sub_material_thickness": {
      "gold": {
        "minimum_thickness": 1.5
      }
    }
  }
]

Processes

The “processes” element type is an “array”. Processes include everything which is done to one or more layers. An example of one hole process could be:

"processes": [
  {
    "function": "hole",
    "attributes": {
      "number_of_holes": 60,
      "hole_type": through,
      "plated": false,
      "size": 0.15,
      "layer_start": "04c09da8-f6f1-4308-8822-b77363d34f9d",
      "layer_stop": "05c10da8-f6f1-4308-8822-b77363d34f9d",
      "protection": "type4a"
    }
  }
]

How to describe processes

Potential tags are:

Tags Description Type Uom Required
uuid An unique identifier for the process string None No
function The function of process. See the list of potential processes below integer None Yes
process_attributes  A object containing attributes to further describe the layer. See potential attributes under each layer type object None  No

Process functions and their attributes

Potential values are:

Metrics

The “metrics” element type is an “object” and can have the following sub-objects:

Board

Boards are one PCB. The following potential tags are available:

Tags Description Type Uom Required
size_x The size of the board in the X-axis Number millimeters Yes
size_y The size of the board in the Y-axis Number millimeters Yes
breakaway_method The method of creation of the breakaways Use only if delivered without an array. Potential values are “routing”, “punching” String None No
thickness The finished thickness of the board Number millimeters Yes

Array

Array (or custom panel) describes the panel that contains several boards. The following potential tags are available:

Tags Description Type Uom Required
size_x The size of the array in the X-axis Number millimeters Yes
size_y The size of the array in the Y-axis Number millimeters Yes
boards_x The number of boards in the array in the X-axis Integer None No
boards_y The number of boards in the array in the Y-axis Integer None No
boards_total Total number of boards in the panel. This is not the preferred method of stating the number, “boards_x” and “boards_y” should be used Integer None No
border_left The size of the left side boarder between the edge and the board Number millimeters No
border_right The size of the right side boarder between the edge and the board Number millimeters No
border_top The size of the top side boarder between the edge and the board Number millimeters No
border_bottom The size of the bottom side boarder between the edge and the board Number millimeters No
board_spacing_x The size of the space between the boards in the x-direction Number millimeters No
board_spacing_y The size of the space between the boards in the y-direction Number millimeters No
fiducials_number The number of fiducials on the array Integer None No
fiducials_size The size of the fiducials Number millimeters No
fiducials_shape The shape of the fiducials. Potential values are “donut”, “circle”, “plus” and “diamond” String None No
breakaway_method One or more methods of creation of the breakaways on the array. Potential values are “routing”, “scoring”, “punching”, “v_cut”, “v_grove”, “jump_scoring” Array of string None No
mouse_bites True if there should be “mouse bites” to allow easy break away of the boards Boolean None No
tooling_holes_number The number of tooling holes on the array Integer None No
tooling_holes_size The size of the tooling holes Number millimeters No
x_outs_allowed Manufacturer can deliver arrays with defect boards as long as these are clearly marked as defect (X’ed out) Boolean None No
x_outs_max_percentage_on_array The maximum number of defective and clearly marked as such boards that are allowed on on panel Number percentage No
transplant_board_allowed Inserting boards from one panel to another to remove x-outs allowed Boolean None No
weight The weight of the array Number grams No

Logistical

The “logistical” element type is an “object” and can have the following sub-objects:

Inner packaging

In describing the inner packaging of several products together before they are put in an outer package and shipped, there are several options to be set. They are all wrapped into a “inner_packing” object. Potential tags are:

Tags Description Type Uom Required
ipc_1601_section_4_2_2_type Choices are “a”, “b”, “c” or “d”. Where “a” is “Nylon/Foil/Polyethylene”, “b” is “Tyvek™/Foil/Polyethylene”, “c” is “Aluminized Polyester/Polyethylene” and “d” is “Clear Plastics/Polymers (non-metallic)” String None No
hic True to include a HIC (Humidity Indicator Card) in the inner packaging Boolean None No
esd True to force the use of electrostatic discharge compatible material Boolean None No
desiccant True if a desiccant should be included Boolean None No
vacuum True to indicate if vacuum is required. Default is shrink wrap Boolean None No
maximum_number_of_arrays The maximum number of arrays/panels that can be packed together in one inner package Integer None No

Configuration

The “configuration” element type is an “object” and can have the following sub-objects:

Tolerances

Impedance

Stackup

When describing the stackup configuration, you can use the following tags:

Tags Description Type Uom Required
locked True if the stackup is locked and cannot be altered by the manufacturer. Default is False Boolean None No
ordered_outer_layers True if the outer layers listed are in exact order. Default is True Boolean None No
ordered_inner_layers True if the inner layers listed are in exact order. Default is True Boolean None No
file_name The name of the file that describes the stackup in further detail String None No

Markings

Markings on the board can happen on several layers, including legends and soldermasks. This section allows you to sum up these markings and attach them to layers.

Tags Description Type Uom Required
layers List one or more layers by UUID that includes markings Array of UUIDs None No
date_code Possible values are “YY” for year, “WW” for week “-“ and “LOT” (alias “BATCH”). E.g. “YYWW-LOT” or “LOT-YYWW”. If no marking, set “NONE” String None No
manufacturer_identification Manufacturer identification Boolean None No
standards Possible values are the ones listed in the subelement standards but typical will be “ul” and “rohs” Array of strings None No
serial_number Serial number should be added in the markings. Default is false Boolean None No
serial_number_format Format of the serial number expressed as a “regular expression” but needs to have x amount of digits in it. String None No
serial_number_start The number to start the serial number from. Will have to replace the digits from the “serial_number_format” above Integer None No
serial_number_increase_by The increase in number from “serial_number_start” with each product Integer None No

Standards

All standards that the finished product needs to be compliant with must be defined here.

Tags Description Type Uom Required
comply_with List one or more standards that the product must comply with. Choices are “ul”, “c_ul”, “rohs”, “ul94”, “esa”, “itar”, “dfars”, “mil_prf_55110”, “mil_prf_50884”, “mil_prf_31032”, “as9100”, “nadcap”, “rw_en45545_2_2013”, “rw_nf_f_16_101”, “rw_uni_cei_11170_3”, “rw_nfpa_130” Array of strings None No
ipc_6010_class According to Table 4-2 /4-3. Choices are “1”, “2”, “3” Integer None No
ipc_6010_compliance_level Choices are “full”, “factory_standard”, “aabus” String None No
ipc_6010_copper_plating_thickness_level Used either if ipc_6010_class is set to 2 and you want to add copper plating thickness demands from class 3, or the other way round - class 3 is set but you can accept demands from class 2. Choices are “2”, “3” Integer None No
ipc_6010_annular_ring_level Used either if ipc_6010_class is set to 2 and you want to add annular ring demands from class 3, or the other way round - class 3 is set but you can accept demands from class 2. Choices are “2”, “3” Integer None No
ipc_6010_conductor_spacing_level Used either if ipc_6010_class is set to 2 and you want to add annular ring demands from class 3, or the other way round - class 3 is set but you can accept demands from class 2. Choices are “2”, “3” Integer None No
ipc_6010_conductor_width_level Used either if ipc_6010_class is set to 2 and you want to add annular ring demands from class 3, or the other way round - class 3 is set but you can accept demands from class 2. Choices are “2”, “3” Integer None No
ipc_6012_class Requirements according to IPC 6012 class. Choices are “1”, “2”, “3”, “3A” (Class 3 Automotive addendum), “3M” (Class 3 Medical addendum), “3S” String None No
ipc_6013_class Requirements according to IPC 6013 for flexible or rigid-flex boards. Choices are “1”, “2”, “3” String None No
ipc_6018 IPC-6018 Microwave End Product Board Inspection and Test Boolean None No

Testing

Describe the requirements for testing of the finished board.

Tags Description Type Uom Required
netlist 100% Netlist testing according to IPC-D-356, ODB++ or IPC2581 Boolean None No
allow_generate_netlist Allow Netlist to be generated from Gerber or other file format if needed Boolean None No
hipot HiPot Test (Dielectric Withstanding Voltage Test) Boolean None No
4_wire Use 4 wired test Boolean None No
ist Use IST testing Boolean None No
impedance Choices are “controlled”, “calculated”, “follow_stackup” String None No

Country Of Origin

Country of Origin is the country where the Printed Circuit Board is/can be manufactured.

Tags Description Type Uom Required
iso_3166_1_alpha_3 A three letter string representation of the Country of origin according too ISO 3166-1. String None No
iso_3166_1_alpha_2 A two letter string representation of the Country of origin according too ISO 3166-1. String None No
nato_member Indicates if the COO is a NATO member state Boolean None No
eu_member Indicates if the COO is a European Union member state. Boolean None No

allowed_modifications

Changes/fabrication decisions that are allowed to make to the files provided.

Tags Description Type Uom Required
dead_pad_removal Non Functioning Pad removal. Boolean None No
add_copper_balancing Adding copper balancing pattern. Boolean None No
add_copper_balancing_on_array Adding copper balancing pattern on array/panel frame. Boolean None No
add_tear_drops Adding Tear Drops. Boolean None No
resize_vias Allow the manufacturer to resize vias to e.g. accomplish a required standard Boolean None No